- Contact Person : Ms. Wang Sarah
- Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
- Tel : 86-755-61514569
- Fax : 86-755-61514586
- Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
- Country/Region : China
- Zip : 518104
UV dicing type
1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm
Feature:
*Wafer dicing, Wafer protection
*UV curing type
*Expandable type
*Precented dicing wafer from penetrating into interface
*Improved back side chipping
*Improved back side contamination by wafer
*Adhesive strength depends on chip size, chip thickness,etc
Specification:
Tape Color: Color
Tape Thickness: 130um
Base Film: Polyolefin/100um
Adhesive: 30um
Adhesion before UV: 3.00 N/10mm
Adhesion after UV: 0.22 N/10mm
Note: UV irradiation should be satisfied the following conditons in order to ensure the standard value
1) more than 100mW/cm2 of illuminance
2) more than 200mJ/cm2 of quantity of UV light
3) Wave length of ultraviolet should be around 365nm
UV dicing type
