Other Electronic Components Manufacturers - Shenzhen Western Hemisphere Technology Co., Ltd.

Anti-static tape

High temperature resistance,can reach to 300C. any size can be customized Kapton Specification:Polyimide tape,is also known as the imitaion fo kapton tape,is with polyimide film as the basic carrier, and coated with different adhesive for different temperature...

High-voltage ESD Tape

1.Material: PET 2.Application: High Voltage 3.Type: Insulation Tape 4.colour:various Specifications: 1.Material: PET2.Application: High Voltage3.Type: Insulation Tape 4.colour:variousinsulation polyester tape is suitable for longitudinal wrap and wrap tape of all kinds of...

Polyester ESD Film tapes in China

1.Material: PET 2.Antistatic: Transparent 3.Feature: Antistatic 4.Adhesive: Acrylic 5.Sample is free Specifications:Clear ESD tape uses cellulose as carrier, it is used in clean room and ESD required areas. Free of adhesion residue.Features:Using cellulose as carrier,it...

PTFE skived sheet

1.Carrier: PTFE 2.Color:black/grey 3.Thickness: 0.05mm-0.2mm 4.Certification:RoHs Description: 1Specification of Virgin PTFE/Teflon Skived Sheet:Thickness: 0.3mm-6mmWidth: 1m; 1.2m; 1.5m; 1.8m; 2m or as you requierdCustomer's sizre are acceptble.Acrylic PTFE Tape -...

PTFE glass cloth adhesive tape

1.Material: Fiberglass 2.Color: Brown/Black 3.Rated Voltage: 220V 4.Tensile Strength: 380 5.Type: Insulation Tape Features : 1.Material: Fiberglass 2.Color: Brown and Black3.Rated Voltage: 220V 4.Tensile Strength: 3805.Type: Insulation Tape Insulation,...

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Product Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Description:1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00...

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...

Best Elep holder back grinding type

1.Type: Dicng Tape for BGA Board 2.Material: Polyolefin(PO) 3.Adhesion(Before UV) 9.00 N/20mm 4.Adhesion(After UV) 0.20 Detailed Product Description- Applicable to thick blade(under 200um) - Expandable type(PO film) - Srong holding and easy peel(UV Curable) ...

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...